1. CAE/CAD and thermal management issues in electronic systems
المؤلف: / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
المکتبة: مكتبات الكلية التقنية بجامعة طهران (طهران)
موضوع: Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
رده :
TK
7870
.
25
.
C34
1997
2. CAE/CAD and thermal management issues in electronic systems
المؤلف: / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
المکتبة: مكتبات الكلية التقنية 1 بجامعة طهران (طهران)
موضوع: Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
رده :
TK
7870
.
25
.
C34
1997
